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| [1.] Mrs/Fragment 025 20 - Diskussion Zuletzt bearbeitet: 2015-05-16 14:27:09 Hindemith | Fragment, Gesichtet, Monserrat De La Luz Garcia Curiel 2004, Mrs, SMWFragment, Schutzlevel sysop, Verschleierung |
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| Untersuchte Arbeit: Seite: 25, Zeilen: 20-22, 25-28 |
Quelle: Monserrat De La Luz Garcia Curiel 2004 Seite(n): 15, 16, Zeilen: 15:36 ff. ; 16: 1 ff. |
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| 2.4.2. Silica
Silica has been used in different polymers as a reinforcement material. Examples are in methacrylate [61-72], polyimide [6, 73], polyamide [74], rubbery epoxies [75], and acrylic [76]. [...] The specific function of the filler is based on the specific resin system, particle size, surface area, loading and surface modification. Because of the high bond energy in the Si-O bond, SiO2 has extremely high thermal stability. SiO2 also possesses a very low thermal expansion coefficient. [6] C. Joly, M. Smaihi, L. Porcar, Chemistry of Materials, 11, 2331 (1999). [61] M.M. Hasan, Y. Zhou, H. Mahfuz, Materials Science and Engineering A 429 (2006) 181– 188 [62] F.Hussain, M.Hojjati, M.Okamoto, Journal of COMPOSITE MATERIALS, Vol. 40, No. 17/2006, and references therein. [63] Zheng, Y.P., Zheng Y. and Ning, R.C. (2003, Materials Letters, 57(19): 2940–2944. [64] Tang, J., Wang, Y., Liu, H., Xia, Y. and Schneider, B. (2003), J. of Applied Polymer Science, 90: 1053–1057. [65] M.W.L. Wilbrink, A.S. Argon, R.E. Cohen, M. Weinberg, Polymer 42 (26) (2001) 10155– 10180. [66] H. Mahfuz, V.K. Rangari, M.S. Islam, S. Jeelani, Compos. Part A: Appl. Sci. Manuf. 35 (4) (2004) 453–460. [67] G. Chen, G. Luo, X. Yang, Y. Sun, J. Wang, Mater. Sci. Eng. A 380 (1–2) (2004) 320– 325. [68] N. Chisholm, H. Mahfuz, V.K. Rangari, A. Ashfaq, S. Jeelani, Compos. Struct. 67 (1) (2005) 115–124. [69] M.Z. Rong, M.Q. Zhang, Y.X. Zheng, H.M. Zeng, K. Friedrich, Polymer 42 (7) (2001) 3001–3004, 3001.98 [70] X. Li, G. Wang, X. Li, Surf. Coatings Technol. 197 (1) (2005) 56–60. [71] G. Vigier, J. Pascualt, J. Gerard, L. David, and Haiji, Journal of Polymer Science. 37, 3172 (1999) [72] Ch. Landry, and B. Coltrain, Polymer 33, 7 (1992). [73] Y. Yang, J. Yin, Z. Qi, and Z. Zhu, Journal of Applied Polymer Science 73, 2977 (1999). [74] F. Yang, Y.Ou, and Z. Yu, Journal of Applied Polymer Science 69, 355 (1998). [75] J. Kolarik, O. Dukh, L. Matejka, Polymer 41, 1449 (2000). [76] K. Qiu, and Z. Huang, Polymer 38, 521 (1997). [77] E. Werner, van Zyl, G. Monserrat, Macromolecular Materials and Engineering, 2002, 287, 106-110, and references therein. [78] E. P. Giannelis, Advanced Materials 1996, 8, 29. |
Silica
Silica has been used in different polymers as a reinforcement material. Examples are in methacrylate [70-73], polyimide [74-75], polyamide [76], rubbery epoxies [77], and acrylic [78]. The specific function of the filler is based on the specific resin system, particle size, surface area, loading and surface modification. Because of the high bond energy in the Si-O bond, SiO2 has extremely high [page 16] thermal stability. SiO2 also possesses a very low thermal expansion coefficient. [70] Brinker, J. and Scherer, G. Sol-Gel Science, Academic Press (1990). D.H. Everett, Basic principles of colloid science Ed. The Royal Society of Chemistry, print. Whitstable, Kent, UK (1988). [71] Vigier, G., Pascualt, J., Gerard, J., David, L. and Haiji, J. Polym. Sci. 37, 3172 (1999). [72] Mallouk, T., Ollivier, J. and Johnson, S. Science 283 (1999). [73] Landry, Ch. and Coltrain, B. Polymer 33, 7 (1992). [74] Smaihi, M., Joly, C. and Noble, R. Chem. Mater. 11, 2331 (1999). [75] Yang, Y., Yin, J., Qi, Z. and Zhu, Z. J. Appl. Polym. Sci. 73, 2977 (1999). [76] Yang, F., Ou, Y. and Yu, Z.-Z. J. Appl. Polym. Sci. 69, 355 (1998). [77] Kolarik, J., Dukh, O., Matejka, L. Polymer 41, 1449 (2000). [78] Qiu, k. and Huang, Z. Polymer 38, 521 (1997). |
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